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Investigation of process parameters effect on the copper-wire drawing

type de publication      article dans une revue internationale avec comité de lecture
date de publication 2009
auteur(s) Vega Guillaume; Haddi A.; Imad Abdellatif
journal (abréviation) Materials & Design (Mater Des)
volume (numéro) 30 (8)
pages 3308 – 3312
résumé In the present paper, the copper-wire drawing process is analysed in order to optimise the die design and to obtain the best quality of wire. Different design parameters of the drawing process have been studied using FE-analysis and experiment. This study investigates the effect of the process variables such as semi-die angle and reduction in area, and the coefficient of friction on the drawing force value. For the wire, elastoviscoplastic behaviour is considered, while the die material is assumed to be elastic. Two types of dies have been used in this work: crystal mono diamond core (MD) and crystal poly diamond (PCD).
Experiments were carried out on drawing machine involving industrial conditions to measure the drawing force. The obtained results have been compared with analytical methods available in literature, particularly, with Siebel, Wistreich and Avitzur’s solutions.
Our results clearly indicate that friction has significant effects on the drawing force which decrease with the decrease of area reduction. The optimum die angle for wire drawing is assumed to be obtained when the plastic strain distribution across the diameter of the wire becomes uniform.
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